Xenon (Motherboard): Difference between revisions

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(can someone add technical stuff like die sizes and nand size etc?)
 
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'''Xenon''' is the original Xbox 360 motherboard. It does not have a HDMI port. The design of the board combined with sub-quality solder made this revision the most likely to give the RRoD.
[[Category:Xbox360_Hardware]]
{{Infobox_Motherboard
|image = Xbox 360 revisions xenon motherboard.jpg
|caption = Xenon Motherboard
|introduced = November 2005
|cpu = 90nm
|gpu = 90nm
|edram = 90nm
|nand = 16MB (64MB XDK)
|powersupply = 203 W
|hdmi = No
|specialnotes = The Xbox 360 launch model motherboard
|powerrating = 12V⎓16.5A
|powerconnector = Powerconnector_xenonzephyr.png
}}


[[Category:Motherboard_Revisions]]
The original Xbox 360 configuration used in the initial Premium and Core machines released in the end of November 2005.<br/> These are also know as the RRoD (Red Ring of Death) machines because the GPU dies fail due to defective design and must be replaced.
 
* 90 nm IBM CPU
* 90 nm ATI GPU and 90nm on-chip eDRAM
* Low profile GPU heatsink - later heatpipe GPU heatsink
* Heatpipe CPU heatsink
* 203 Watt output power supply (16.5 A)
* Shipping with Hitachi and Samsung DVD-Drive
* Later models have glue around the CPU and GPU
 
{{Xenon Timeline}}
 
[[Category:Xbox360_Hardware]]

Latest revision as of 16:01, 3 August 2020

Xenon (Motherboard)
Xbox 360 revisions xenon motherboard.jpg
Xenon Motherboard
Introduced November 2005
CPU Process 90nm
GPU Process 90nm
eDRAM Process 90nm
Power Supply 203 W
NAND 16MB (64MB XDK)
HDMI No
Special Notes The Xbox 360 launch model motherboard
Power Rating 12V⎓16.5A
Power Connector
Powerconnector xenonzephyr.png

The original Xbox 360 configuration used in the initial Premium and Core machines released in the end of November 2005.
These are also know as the RRoD (Red Ring of Death) machines because the GPU dies fail due to defective design and must be replaced.

  • 90 nm IBM CPU
  • 90 nm ATI GPU and 90nm on-chip eDRAM
  • Low profile GPU heatsink - later heatpipe GPU heatsink
  • Heatpipe CPU heatsink
  • 203 Watt output power supply (16.5 A)
  • Shipping with Hitachi and Samsung DVD-Drive
  • Later models have glue around the CPU and GPU