Xenon (Motherboard): Difference between revisions
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Power Connector
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* Shipping with Hitachi and Samsung DVD-Drive | * Shipping with Hitachi and Samsung DVD-Drive | ||
* Later models have glue around the CPU and GPU | * Later models have glue around the CPU and GPU | ||
{{Xenon Timeline}} | |||
[[Category:Xbox360_Hardware]] | [[Category:Xbox360_Hardware]] | ||
Revision as of 22:46, 2 August 2020
Xenon (Motherboard)
Xenon Motherboard
| Introduced | November 2005 |
|---|---|
| CPU Process | 90nm |
| GPU Process | 90nm |
| eDRAM Process | 90nm |
| Power Supply | 203 W |
| NAND | 16MB (Devkit 64MB) |
| HDMI | No |
| Special Notes | The Xbox 360 launch model motherboard |
| Power Rating | 12V⎓16.5A |
The original Xbox 360 configuration used in the initial Premium and Core machines released in the end of November 2005.
These are also know as the RRoD (Red Ring of Death) machines because the GPU chip warps away from the motherboard because of excessive heat.
- 90 nm IBM CPU
- 90 nm ATI GPU and 90nm on-chip eDRAM
- Low profile GPU cooler
- Standard CPU cooler
- 203 Watt output power supply (16.5 A)
- Shipping with Hitachi and Samsung DVD-Drive
- Later models have glue around the CPU and GPU
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