Jasper is the codename of the fifth motherboard revision for the Xbox 360. On Jasper motherboards found within Arcade SKUs, this Xbox 360 Motherboard revision features an onboard memory unit to facilitate the NXE Dashboard.
- 1 Identification
- 2 Hardware Notes
- 3 Jasper (V4.0)
- 4 Jasper/Kronos (V4.1)
- 5 Stress Kits/Prototypes (512-MB)
- 6 XNA Dev/Test Kit (1-GB Kits)
- 7 XNA Prototype (ADK/AJDK)
- 8 References
- 9 Gallery
The following methods can be used to identify a Jasper board (only on PHAT boards):
- The Southbridge on Jasper boards is a new chip "PSB" with a new black design, older boards use the "XSB" with a circular metal top.
Identification between Jasper v1 and Jasper v2/Kronos boards
- Kronos boards only ever use solid state capacitors on the CPU/GPU Output Filter rail, Jasper v1 boards switch between electrolytic and solid-state capacitors depending on the factory
- Kronos boards are missing the marking/pads for a third coil near the CPU Output Filter capacitors, Jasper v1 boards still have this marking
- Kronos GPUs have a Kronos 1 marking on them, Jasper v1 GPUs have no marking
- Kronos boards use the older-style GPU heatsink with no heatpipe, Jasper v1 boards use the better GPU heatsink with a heatpipe
The connections required to dump/flash the NAND are the same as all previous models.
Performing the SMC Hack requires the same wiring as Zephyr, Opus, and Falcon mainboards. This is a slightly different set of connections than those required for the Xenon mainboard.
Adding XDK LEDs
The SMC activity and Checkstop LEDs normally present on XDKs can be added to retail Jasper boards by adding the following parts:
(Reversed by Octal450)
- Stuff Q8B6 with ON Semiconductor MMBT2222 SOT23 General Purpose Transistor
- Stuff R8B6 with 2K Ohm 1% 0402 Resistor
- Stuff R8A5 with 1K Ohm 1% 0402 Resistor
- Stuff D8B4 with Green 0603 LED
- Stuff U1U1 with SN74LVC1G14 SC70
- Stuff R1U3 with 249 (or 270) Ohm 0402 Resistor
- Stuff D1F1 with Yellow 0603 LED
- Consoles: Arcade 256MB & 512MB, Pro/Premium 60GB, Elite 120GB & 250GB and Resident Evil 5 console
- 65nm IBM CPU
- 65nm ATI GPU
- 80nm eDRAM
- 150 Watt PSU (12V rated for 12.1A, new connector)
- Arcade Edition Larger Flash 256MB Hynix HY27UF082G2B or 512MB Hynix HY27UF084G2B on-board flash, up from 16MB HY27US08281A flash, to accommodate the NXE update.
- New Southbridge "PSB" chipset
- Same heatsinks as Falcon
- 3 pin fan connector.
- Shipping with LiteOn 7XXX/8XXX/V2/9XXX DVD-Drivers.
- Fixes red ring of death (RROD) due to the redesigned GPU
- It is possible to upgrade to a Jasper/Kronos board by installing the X820894-001 Kronos1 GPU.
Same as Jasper (V4) other than some minor changes.
- Consoles: Arcade 512MB, Pro/Premium 60GB, Elite 120GB & 250GB, Modern Warfare 2 consoles and Final Fantasy 13 consoles
- New Kronos1 GPU stepping
- 65nm IBM CPU
- 65nm ATI GPU
- 65nm eDRAM
- Arcade Edition Larger Flash 512MB Hynix HY27UF082G2B on-board flash, up from 16MB HY27US08281A flash, to accommodate the NXE update.
- Shipping with Lite-On 8XXXV2/9XXX DVD-Drivers.
- JTAG Hack / SMC patched on CB level
- Removes 8 chips of 64MB RAM option, all boards now using 4 chips of 128MB
- Xenon style GPU heat sink with Falcon style CPU heat sink
- Special edition consoles: Modern Warfare 2 Consoles
- Last of the original style 360 systems
- Fixes E 74 error due to the redesigned eDRAM
Stress Kits/Prototypes (512-MB)
Consoles used for intense internal stressing. Such as stressing GPU, CPU, and memory configurations on the console.
Stress kits have two wires sticking out the top, known as stress wires. These stress wires can be plugged into a lamprey board. This allows the hardware engineer to programmed consoles en masse as well as monitor performance.
Consoles used for testing different voltage settings for HDDM. They are known to come with or without stress wires.
Normal Voltage Kits
High Voltage Kits
Low Voltage Kits
XNA Dev/Test Kit (1-GB Kits)
The final development/test kit for the Jasper and phat Xbox 360.
Featured an extra 512MB of RAM for 1GB total, a redesigned sidecar shell that allows for hard drive removal without disassembling the entire console and a new case design sporting XNA branding (on some models) and XNA colors.
The new XNA sidecar shell also covers up the PIX USB port as it's usage was moved to ethernet. The port is still present within the sidecar but was just covered by the plastic shell.
As with other XDKs, there was an full Development Kit option and Test Kit option with the same limitations as other XDKs.
XNA Development Kits have a blue XNA chrome design and blue Ring of Light boards.
XNA Test Kits have a dark green chrome design and standard green Ring of Light boards.
Early XNA kits had both XNA branded sidecars and XNA branded faceplates.
Very rare due to the scarcity of XNA branded faceplates.
These were only present on early kits due to Microsoft liquidating their stock of sidecar shells and faceplates.
Same as Expo Kits but without the XNA branded faceplate (only the branded sidecar).
Much more common than full Expo Kits.
No XNA branding present on the sidecar shell or faceplate.
XNA Prototype (ADK/AJDK)
XNA Prototype XDKs were early prototypes of the final XNA development kit that came with a new case design and 1GB of upgraded RAM for developer use.
The XNA XDK was originally planned with an extra Gigabit Ethernet port. This ended up being scrapped and is only present on the XNA Prototype XDKs.
XNA Prototype Development kits were known internally as Advanced Developer Kits (ADK) or Advanced Jasper Developer Kits (AJDK). This is reflected on prototype XNA development kit names. The "Advanced" in ADK may also refer to the Xbox Advanced Technology Group responsible for developing the Xbox hardware and tools.
The first Xbox 360 XDK board with 1GB of upgraded RAM. It used a white retail Xbox 360 case with prototype stickers and had a Gigabit Ethernet board mounted to the hard drive case.
It did not feature a sidecar and had a standard green Ring of Light.
Featured the same white retail case, 1GB of RAM and inverted ring of light as the version 1 prototype.
The version 2 prototype was the first to feature a sidecar with the new redesigned XNA shell. It was black colored plastic (appears dark blue in some cases) with no XNA branding and featured the Gigabit Ethernet board inside.
The Ring of Light board in version 2/3 prototypes is inverted featuring red and blue LEDs.
Same as the version 2 prototype but with a blue chrome XNA branded sidecar shell.
Version 4 (GDC Expo)
The first XNA development kit to feature the final XNA branded case design. Still featured a Gigabit Ethernet XNA branded sidecar and had an XNA branded faceplate.
Although the Gigabit Ethernet port was still present on the sidecar, the feature was already planned to be dropped from the final design. The port was covered with a serial sticker during the GDC Expo in 2009 in order to better represent the final design.
Produced in 2008.
Same as the previous version 4 prototype but with later manufacturing dates. Uses a different info sticker than v4 prototype or final Expo XNA kits.
Produced in 2009.