Xbox 360 Motherboards

• Xenon V1: Original Xbox360 mainboard
  • 16.5 A
  • 90nm CPU & GPU
  • 90nm eDRAM
  • 203 Watt PSU
  • hitaci, samsung, benq, liteon 7XXX drives used

• Zephyr V2: Updated Xbox360 mainboard
  • 16.5 A
  • 90nm CPU & GPU
  • 90nm eDRAM
  • 203 Watt PSU
  • HDMI.
  • 3 pin fan connector
  • new GPU heatsink with at heatpipe
  • benq, hitachi drives used

• Falcon V3
  • new CPU Heatsink + the GPU heatsink with heatpipe
  • 14.1A
  • 65nm CPU.
  • 80nm GPU.
  • 80nm eDRAM
  • HDMI.
  • 175 Watt PSU.
  • Ram removed from bottom of mainboard on later models.
  • Arcade Edition w/256MB Memory Card
  • 3 pin fan connector
  • benq, hitachi, liteon 7XXX drives used

• Opus V3.1: Updated board that fits in original Xenon cases
  • Updated Heatsinks
  • 80nm GPU.
  • 80nm eDRAM
  • 175 Watt PSU
  • 3 pin fan connector
  • just a falcon without HDMI
  • benq, hitachi, liteon 7XXX, samsung drives used
  • opus only available from xenon being repaired by M$

• Jasper V4.1:
  • new style CPU Heatsink + the GPU heatsink with heatpipe
  • 12.1A
  • 65nm CPU and GPU
  • 80nm eDRAM
  • 150 Watt PSU
  • Arcade Edition Flash size from 16MB, 256MB and 512MB to accommodate NXE (Removes 256MB Memory Card)
  • 3 pin fan connector
  • new southbridge
  • Ram removed from bottom of mainboard
  • liteon 7XXX/8XXX/V2/9XXX dives used
  • new warranty sticker

• Jasper V2 V4.2:
  • new style CPU Heatsink + the GPU heatsink without heatpipe
  • 12.1A
  • 65nm CPU and GPU
  • 80nm eDRAM?
  • 150 Watt PSU
  • Arcade Edition Flash size from 16MB, 256MB and 512MB to accommodate NXE (Removes 256MB Memory Card)
  • 3 pin fan connector
  • new southbridge
  • Ram removed from bottom of mainboard
  • liteon 8XXXV2/9XXX dives used
  • new warranty sticker

• Valhalla V5 (Future Release?)
  • Natel
  • Unified single chip with both CPU/GPU dies possibly @ 45nm process.
  • new form factor